南華早報

Suzhou Dongshan raises less than expected in US$1.8b Hong Kong IPO

作者 Zoe SL Chan

文章摘要

南華早報 · 文章頁摘要

With the overallotment, the circuit board maker could raise US$1.84 billion, compared with expectations of up to US$3 billion a week ago.

Suzhou Dongshan raises less than expected in US$1.8b Hong Kong IPO(新聞配圖)
配圖來源:南華早報

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