南華早報Suzhou Dongshan raises less than expected in US$1.8b Hong Kong IPO
作者 Zoe SL Chan全文約 3,180 字
文章摘要
南華早報 · 文章頁摘要With the overallotment, the circuit board maker could raise US$1.84 billion, compared with expectations of up to US$3 billion a week ago.
Suzhou Dongshan Precision Manufacturing raised less than expected in its Hong Kong initial public offering (IPO), as investors weighed potential US tr...