南華早報

Japanese giant expands China chip packaging materials output amid AI boom

作者 Howard Liu全文約 4,117 字

文章摘要

南華早報 · 文章頁摘要

The investment underscores the growing importance of advanced packaging materials in the semiconductor supply chain.

Japanese giant expands China chip packaging materials output amid AI boom（新聞配圖）
配圖來源：南華早報

Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marki...

https://www.scmp.com/tech/tech-trends/article/3370468/japans-sumitomo-bakelite-expands-china-chip-packaging-materials-output-amid-ai-boom